The CMP equipment designed to address new More than Moore challenges

Capstone’s latest CMP tool for emerging technologies can process thin and brittle specialty substrates thanks to its state-of-the art electronics and components.
Coupled with Axus’s latest polishing head, it offers significantly lower WIW non-uniformity compared to rigid plates legacy carriers.
In addition to a 40% reduction in slurry consumption, the drastically reduced footprint and wafer size flexibility enables the throughput per m2 to realistically double.
All these innovations enable a reduction of COC & COO resulting in a lowest cost per wafer.