CMP – Axus Capstone

The CMP equipment designed to address new More than Moore challenges

Capstone’s latest CMP tool for emerging technologies can process thin and brittle specialty substrates thanks to its state-of-the art electronics and components.
Coupled with Axus’s latest polishing head, it offers significantly lower WIW non-uniformity compared to rigid plates legacy carriers.
In addition to a 40% reduction in slurry consumption, the drastically reduced footprint and wafer size flexibility enables the throughput per m2 to realistically double.
All these innovations enable a reduction of COC & COO resulting in a lowest cost per wafer.